SK Hynix

SK Hynix Reveals 238-Layer 3D NAND: Incoming Cheap and Fast SSDs

SK Hynix has introduced its first 3D NAND device with 238 layers, the highest number of layers in the industry. The new 512Gb devices promise to be quite cheap and will allow SK Hynix to build cheap solid-state storage. In addition, the 512Gb 238-layer 3D NAND products will help the memory manufacturer learn how to mass-produce flash memory with a large number of layers.

SK Hynix’s first 238-layer 3D NAND device features triple-level cell (TLC) architecture, 512Gb (64GB) capacity, and 2400MT/s interface speed, a 50% increase in compared to the previous generation NAND flagship from the South Korean manufacturer. As an added benefit, the new 3D NAND memory device reduces power consumption during reading by 21%, which will be an advantage for both mobile PCs and smartphones.

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